DS7402 8 Layer HDI boards Immersion gold surface for Storage Card boards
HDI boards are one of the fastest growing PCB technologies. These contain blind and/or buried vias and often contain micro-vias which are 0.006 or less in diameter. Moreover HDI boards consist of high circuit density compare to traditional circuit boards.
HDI technology leads to space reduction, line reduction, via diameter reduction, BGA pitch reduction, pre-preg thickness reduction, board thickness reduction etc. Moreover HDI PCB supports about 4 to 24 number of layers. PCB thickness in the range from 0.4 to 2.8 mm are supported. Minimum track/gap of about 65/65 µm are supported.
- The solder joint defect rate is low, the high frequency characteristic is good, and the electromagnetic and radio frequency interference are reduced. High precision and high practicability.
- It is easy to realize automation, improve production efficiency, and reduce costs by 30% to 50%. Save materials, energy, equipment, manpower, time, etc.
- The assembly density is high, the electronic products are small in size, and the weight is light. The volume and weight of the patch components are only about 1/10 of the traditional plug-in components.
- After SMT is generally adopted, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%. High reliability and strong anti-vibration ability.
1. Product application
Storage card (SSD) High Density Interconnection (HDI) products can be used in electronic computing and storage devices.
- Convert M.2 NGFF PCIe based SSD to work in main board PCIe x4 bus slot.
- Movable M.2 NGFF stand-offs and multiple plated-holes supports 2280, 2260, 2242 and 2230 SSDs.
- M.2 PCIe SSD gets power from motherboard PCIe bus slot 3.3V.
- Supports industrial operating temperature range: -40 - 85 ºC.
- Motherboard Requirement :An empty PCIe 3.0 or PCIe 2.0 x4, x8, or x16 slot, supports PCIe 2.0 and PCIe 3.0 motherboard.
- Custom pcb board hytepro oem/odm circuit board.
2 . Specifications:
| Name |
8Layer HDI for Storage Card boards |
| Layer |
8 |
| Quality Grade |
IPC 6012 Class 2,IPC 6012 Class 3 |
| Material |
DS7402 |
| Min Track/Spacing |
75um/100um |
| Drilling Size |
100um |
| Solder Mask |
Green |
| Silkscreen |
White |
| Surface Finish |
Immersion gold |
| Finished Copper |
1/3OZ |
| Production time |
10-21 working days |
| Lead time |
2-3 days
|
1: We have a high-quality, professional, honest and positive core team. Team members have rich experience in SMT, wave soldering, testing tooling and fixtures. The company has clearly established quality, production, engineering, procurement, warehousing and other departments, and strictly implements the ISO9001 system to ensure orderly production and high quality! 2: We pay more attention to customer needs and product requirements, and pay more attention to product quality and continuous improvement. Customer first is our eternal purpose. The team members have extensive experience in the resource integration of component procurement. We are enterprising, we work hard, we continue to learn, continue to improve, absorb the strengths of others, and make our team more perfect.
What can we do for you?
1) We can offer sample .
2) Competitive Price( Factory direct price).
3) On time delivery.
4) Good customers service.
5) Professional Technology.
6) Quality Control through the whole Manufacturing process.
a. Check the material before the production.
b. Have the random inspection during the production.
c. Make the 100% inspection before the shipment.
Product Tags:
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1/3OZ Hard Disk SSD Pcb Board Prototype DS7402 8 Layer Immersion Gold Images
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